WISDOMSHOW WDS-880D PLC Automatic BGA

Stable Temperature Control

WISDOMSHOW WDS-880D PLC Automatic BGA Rework Station High Precision Reflow Soldering Equipment Cellphone PS5 CPC4 Motherboard

The WISDOMSHOW WDS-880D PLC Automatic BGA Rework Station is designed for high precision reflow soldering applications. It is suitable for repairing cellphones, PS5, CPC4, and various motherboard components. The advanced PLC control system ensures stable and accurate temperature management. Its automatic operation improves efficiency and reduces manual errors during repair work. Ideal for industrial use, it delivers reliable and consistent soldering performance.

PLC controlled system ensures stable precise operation
High precision reflow soldering improves repair quality
Automatic function reduces manual intervention and errors
Suitable for cellphone PS5 motherboard repair tasks
Advanced temperature control ensures consistent heating performance
Industrial design provides reliable long term durability

Key Attributes Description

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Key Attributes

Machine Type	Reflow Soldering Equipment	Voltage	220 V
Core Components	PLC	Warranty	1 Year
Machinery Test Report	Provided	Video Outgoing Inspection	Provided
Weight (KG)	200 kg	Brand Name	WISDOMSHOW
Place of Origin	China

Packaging and Delivery

Selling Units

Single Item

WDS-880D Automatic Optical BGA Rework Station

The integrated hot air head and placement head design features automatic placement, soldering, and removal.
The upper head utilizes a hot air system for rapid, uniform heating and rapid cooling (with a 50-80°C drop), effectively meeting the requirements of lead-free soldering.
The lower heating zone utilizes a hybrid system of infrared and hot air. Infrared radiation directly impacts the heating area, simultaneously conducting heat with the hot air. This compensates for each other’s shortcomings, allowing for rapid PCB heating (up to 10°C/s) while maintaining uniform temperature.
The upper and lower zones are synchronized and automatically move to any position within the bottom infrared preheating zone. The lower zone supports the PCB and is motor-controlled. The PCB remains stationary on the fixture, while the upper and lower heating heads move seamlessly to the target chip on the PCB.
The PCB holder utilizes high-precision sliders to ensure accurate placement of BGAs and PCBs.
The unique bottom preheating platform utilizes premium German-imported heating materials (infrared gold-plated light tubes) and anti-glare constant-temperature glass (temperature-resistant up to 1800°C), providing a preheating area of 500 x 420 mm.

Product Parameters

Total Power	5800–8200 W	Upper Heating Power Supply	1600 W
Lower Heating Power Supply	1200 W	IR Heating Power Supply	2400–4800 W
Power Supply	Two-phase 220V, 50/60Hz	Positioning Method	V-shaped slot with laser positioning and joystick X/Y movement
Temperature Control	High-precision K-type thermocouple closed-loop control (±1°C accuracy)	Electrical Control System	PC system + temperature module + motion board + Panasonic servo + stepper driver
Tin Point Monitoring	External camera (optional) monitors solder ball melting	MES System	Reserved MES port
Feeding Device	Automatic feeding system	Maximum PCB Size	590 × 400 mm
Minimum PCB Size	10 × 10 mm	Temperature Measuring Interfaces	4
Chip Magnification	2–80×	PCB Thickness	0.5–10 mm
Applicable Chip Size	0.8 × 0.8 mm – 90 × 90 mm	Minimum Chip Spacing	0.15 mm
Maximum Load	300 g	Mounting Accuracy	±0.01 mm
Overall Dimensions	820 × 760 × 1400 mm	Machine Weight	About 200 kg
Other Features	Dual joystick operation, automatic/manual mode switching, 7-axis motion control, dual-channel heating, MES port, smoke purification system

WISDOMSHOW WDS-880D PLC Automatic BGA

WISDOMSHOW WDS-880D PLC Automatic BGA Rework Station High Precision Reflow Soldering Equipment Cellphone PS5 CPC4 Motherboard

Key Attributes

Packaging and Delivery

WDS-880D Automatic Optical BGA Rework Station

Product Parameters

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