Professional Motherboard Repair
Key Attributes
| Machine Type | Reflow Soldering Equipment | Voltage | 220 V |
| Core Components | PLC | Warranty | 1 Year |
| Machinery Test Report | Provided | Video Outgoing Inspection | Provided |
| Weight (KG) | 200 kg | Brand Name | WISDOMSHOW |
| Place of Origin | China | ||
Packaging and Delivery
| Selling Units | Single Item |
WDS-880D Automatic Optical BGA Rework Station
- The integrated hot air head and placement head design features automatic placement, soldering, and removal.
- The upper head utilizes a hot air system for rapid, uniform heating and rapid cooling (with a 50-80°C drop), effectively meeting the requirements of lead-free soldering.
- The lower heating zone utilizes a hybrid system of infrared and hot air. Infrared radiation directly impacts the heating area, simultaneously conducting heat with the hot air. This compensates for each other’s shortcomings, allowing for rapid PCB heating (up to 10°C/s) while maintaining uniform temperature.
- The upper and lower zones are synchronized and automatically move to any position within the bottom infrared preheating zone. The lower zone supports the PCB and is motor-controlled. The PCB remains stationary on the fixture, while the upper and lower heating heads move seamlessly to the target chip on the PCB.
- The PCB holder utilizes high-precision sliders to ensure accurate placement of BGAs and PCBs.
- The unique bottom preheating platform utilizes premium German-imported heating materials (infrared gold-plated light tubes) and anti-glare constant-temperature glass (temperature-resistant up to 1800°C), providing a preheating area of 500 x 420 mm.
Product Parameters
| Total Power | 5800–8200 W | Upper Heating Power Supply | 1600 W |
| Lower Heating Power Supply | 1200 W | IR Heating Power Supply | 2400–4800 W |
| Power Supply | Two-phase 220V, 50/60Hz | Positioning Method | V-shaped slot with laser positioning and joystick X/Y movement |
| Temperature Control | High-precision K-type thermocouple closed-loop control (±1°C accuracy) | Electrical Control System | PC system + temperature module + motion board + Panasonic servo + stepper driver |
| Tin Point Monitoring | External camera (optional) monitors solder ball melting | MES System | Reserved MES port |
| Feeding Device | Automatic feeding system | Maximum PCB Size | 590 × 400 mm |
| Minimum PCB Size | 10 × 10 mm | Temperature Measuring Interfaces | 4 |
| Chip Magnification | 2–80× | PCB Thickness | 0.5–10 mm |
| Applicable Chip Size | 0.8 × 0.8 mm – 90 × 90 mm | Minimum Chip Spacing | 0.15 mm |
| Maximum Load | 300 g | Mounting Accuracy | ±0.01 mm |
| Overall Dimensions | 820 × 760 × 1400 mm | Machine Weight | About 200 kg |
| Other Features | Dual joystick operation, automatic/manual mode switching, 7-axis motion control, dual-channel heating, MES port, smoke purification system | ||
