SuperBOT 9

Maximum Throughput. Zero Compromise

SuperBOT 9 – High Speed Automated IC Programming System

SuperBOT 9 is a high-speed automated IC programming system offering ultra-fast throughput, precise device handling, and superior reliability for large-scale production. It streamlines mass programming operations with advanced robotics, intelligent algorithms, and consistent high-quality performance.

Programs up to 2,800+ units per hour
Ideal for high-volume IC manufacturing
Reduces labor costs with automated precision
Supports Tray, Tape, Ink Dot, and Laser Marker
Seamless integration into existing production lines
Ensures reliable and repeatable programming results
Works with MES systems for streamlined manufacturing
Compatible with Hardware Security Modules (HSM)
Barcode and QR code integration for enhanced automation

Description Specs I/O Video

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SuperBOT 9 – High-Performance Automated IC Programming System

The SuperBOT 9 is a next-generation, fully automated IC programming solution engineered for high-volume electronic production. Designed to streamline your workflow, it replaces time-consuming manual operations with a fast, precise, and reliable automated process. From chip pickup and placement to programming, removal, and packaging, every step is handled seamlessly by the SuperBOT 9—delivering unmatched efficiency, consistency, and scalability. By combining Xeltek’s industry-leading SuperPro programmers with advanced robotic automation, the SuperBOT 9 ensures optimal performance, reduced errors, and maximum throughput—making it the ideal choice for professional manufacturers who demand accuracy and productivity.

Universal IC Programmer

8 SuperPro 7500N universal programmers
Supports 144,000+ devices with continuous updates

High Throughput

2,800+ units per hour (UPH)

Vision Check

Precise chip placement with orientation and position verification prior to socket insertion
Vision accuracy: 0.01mm

Devices & Packages

Supports: NAND, eMMC, NOR Flash, microcontrollers, and more
Packages: WLCSP, SOT, BGA, TSSOP, PLCC, QFN, SOIC, etc.
Minimum chip size: 1 × 1 mm

Supported I/O Peripherals

Auto Tray (load up to 25 trays)
Tape Out Handler (adjustable tape reel; cold or heat sealing)
Electric Tape-In Feeder (dual option)
Air Ionizer

Marking Functions

Laser Marker: letters, alphanumerics, and symbols
Label Printer: QR codes and barcodes
Dot ink marker

Socket Adapters

Xeltek provides high-performance single and 4-gang socket adapters for automated programming. Each 4-gang adapter integrates four sockets for simultaneous multi-chip programming. With eight 4-gang adapters, you can program up to 32 chips at once—boosting throughput, reducing cycle time, and minimizing labor costs. Supported packages include BGA, QFN, SOP, and TSOP, across NAND, eMMC, microcontrollers, and more.

API Support

Applications can be integrated via API protocol.

Hardware Security Module (HSM)
MES

Support & Warranty

2-year hardware warranty
5-year free remote support
Free device support
Free factory training
*Zero service contracts

For more information about the SuperBOT series or to request a quote, contact us today.

SuperBOT 9 Specifications	High-Speed Automated IC Programmer
Chips & Package Types
Chip Size	Min: 1x1mm, Max: 25x25mm
Supported Devices	EPROM, Paged EPROM, Parallel & Serial EEPROM, FPGA PROM, Flash Memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontrollers (MCU), and more.
Available Socket Adapters	PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, WLCSP, SCSP, and more.
Air Requirements
Required Pressure	0.6 MPa
Air Consumption	72 Liters/Min
Hardware & Operating System
Operating System	Windows™
Integrated Computer	Built-in Industrial PC
Programming Hardware	SuperPro 7500N
Remote Connectivity	LAN Remote Access Supported
Electrical Specifications
Voltage Input	AC 200-240V
Power	2.5KVA

Manual Tray (Standard Equipment)

The SuperBOT Manual Tray is the default I/O device, where operators manually replace trays once a full cycle is complete. This option requires no additional automation, making it a cost-effective solution.

Auto Tray Device

The Automated Tray Handler feeds unprogrammed chips into the system and stacks completed trays. This high-speed tray exchanger can handle up to 25 trays at a time, reducing manual labor and improving efficiency.

Tape-In Device

The Automated Tape-In Feeder supports electric tape widths from 8mm to 44mm, ensuring compatibility with various chip sizes for seamless automated loading.

Tape-Out Device

The SuperBOT Tape-Out Device repackages programmed ICs into tape reels for production workflows. Features an adjustable rail to accommodate multiple tape sizes and supports hot and cold sealing options.

Tube-In Device

The High-Speed Tube-In Handler removes chips from tube packaging and supports various tube sizes. Capable of handling up to 8 tubes simultaneously, optimizing component feeding efficiency.

Tube-Out Device

The Tube-Out Repackaging System repackages chips into tubes, supporting up to 8 tubes at a time. Designed for high-volume automated IC programming workflows.

Laser Marker System

The SuperBOT Fiber Laser Marking System is designed for high-precision IC marking. Integrated with Tray and Tape handlers, it supports engraving letters, numbers, and custom symbols for batch marking.

Ink Marker

The SuperBOT Ink Dot Marker is optimized for high-speed marking applications, adding visual identifiers to components on Tape and Tray handlers.