Mobile Repairing SMD Machine

Precision SMD Repair Made Easy

Mobile Repairing SMD Machine

A Mobile Repairing SMD Machine is designed for the precise removal and reworking of small SMD and IC components on mobile phone PCBs. It offers controlled heating, stable performance, and easy operation, making it ideal for service centers and technicians to carry out accurate, damage-free repairs efficiently.

Accurate hot air control for SMD and IC rework
Suitable for mobile phone PCB repair and servicing
Fast heating with stable temperature control
Supports BGA, QFN, and small SMD components
User-friendly operation for technicians and service centers

Application of CCD Camera Mobile Repairing SMD Machine Product Specification Specification of MCGS Touch Screen Mobile Repairing SMD Machine Details of Hot Air Mobile Repairing SMD Machine Packing & Shipment of Automatic Mobile Repairing SMD Machine Split Vision Related Knowledge

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Especially suitable for repairing mobile phone motherboards and small motherboards. Suitable for different kinds of chips: BGA, PGA, POP, BQFP, QFN, SOT223, PLCC, TQFP, TDFN, TSOP, PBGA, CPGA, and LED chip.

The CCD camera in a mobile repairing SMD machine is used to provide clear, magnified visual monitoring during component removal and placement. It helps technicians accurately align tiny SMD and IC components, detect soldering defects, and perform precise rework on mobile PCBs, improving repair accuracy and reducing the risk of board damage.

Widely used in Chip Level Repairing in mobile phone, small control boards or tiny motherboards etc.
Desoldering, mounting and soldering automatically.
HD CCD Optical Alignment system for precisely mounting BGA and Components
Movable universal fixture prevent pcb from damaged on fringe component, suitable for all kinds of pcb repairing.
High power LED light to ensure brightness for working, and different size of magnet nozzles, titanium alloy material, easy replace and install, never deformation and rusty.

Power	5300W
Top heater	Hot air 1200W
Bottom heater	Hot air 1200W, Infrared 2700W
Power supply	AC220V±10% 50/60Hz
Dimension	L530W670H790 mm
Positioning	V-groove PCB support, and with external universal fixture
Temperature control	K type thermocouple, closed loop control, independent heating
Temperature accuracy	+2°C
PCB size	Max 450490 mm, Min 2222 mm
Workbench fine-tuning	±15mm forward/backward,+15mm right/left
BGA chip	8080-11mm
Minimum chip spacing	0.15mm
Temp Sensor	(optional)

Automatic Mobile Repairing SMD Machine Split Vision

The automatic mobile repairing SMD machine with split vision is carefully packed using shock-proof, moisture-resistant materials to ensure complete protection during transit. Each unit is securely sealed, inspected, and properly labeled for safe handling, ensuring it reaches customers in perfect working condition and ready for installation.

Shock-proof and moisture-resistant packaging for safe transportation
Secure fixing to prevent movement and transit damage
Protective covering for optics, CCD camera, and precision parts
Pre-shipment inspection to ensure product quality and readiness
Clear labeling for safe handling and easy identification

The effect of the surface coating (plating) layer of the PCB on the design:

At present, the widely used conventional surface treatment methods are OSP gold-plated gold-plated spray tin.
We can compare the advantages and disadvantages of cost, weldability, wear resistance, oxidation resistance and production process, drilling and circuit modification.
OSP process: low cost, good conductivity and flatness, but poor oxidation resistance, not conducive to preservation. The drilling compensation is usually made according to 0.1mm, and the HOZ copper thick line width is compensated by 0.025mm. Considering the extremely easy oxidation and dusting, the OSP process is completed after the forming cleaning. When the single piece size is less than 80MM, the piece form must be considered. delivery.
Electroplating nickel gold process: good oxidation resistance and wear resistance. When used for plugs or contact points, the thickness of the gold layer is greater than or equal to 1.3um. The thickness of the gold layer used for welding is usually 0.05-0.1um, but the relative solderability. Poor. The drilling compensation is made according to 0.1mm, and the line width is not compensated. When the copper plate is made of 1OZ or more, the copper layer under the surface gold layer is likely to cause excessive etching and collapse to cause solderability. Gold plating requires current assistance. The gold plating process is designed to be etched before the surface is completely etched. After etching, the process of removing the etch is reduced. This is why the line width is not compensated.
Electroless nickel-plated gold (immersion gold) process: good oxidation resistance, good enthalpy, flat coating is widely used in SMT board, drilling compensation is made according to 0.15mm, HOZ copper thick line width is compensated 0.025mm, because the immersion gold process is designed in After the solder mask, the etch resistance protection is needed before etching, and the etch resistance needs to be removed after etching. Therefore, the line width compensation is more than that of the gold plating plate, so the gold is deposited after the solder resist, and most of the lines have the solder mask coverage without the need for sinking gold. For a large area of copper skin, the amount of gold salt consumed by the immersion gold plate is significantly lower than that of the gold plate.
Spraying tin plate (63 tin / 37 lead) process: oxidation resistance, susceptibility is relatively best, flatness is poor, drilling compensation is made according to 0.15mm, HOZ copper thickness line width compensation is 0.025mm, process and sinking basic Consistently, it is currently the most common type of surface treatment.
Due to the EU’s ROHS directive, the use of six hazardous substances containing lead, mercury, cadmium, hexavalent chromium, polybrominated diphenyl ether (PBDE) and polybrominated biphenyl (PBB) was refused, and the surface treatment introduced a pure tin spray (tin-copper ), spraying pure tin (tin silver copper), immersion silver and immersion tin and other new processes to replace the process of spraying lead and tin.

Mobile Repairing SMD Machine

Automatic Mobile Repairing SMD Machine Split Vision

The effect of the surface coating (plating) layer of the PCB on the design:

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