Spectification of Microscope Camera
WDS-650 BGA rework station is a high-precision system specifically designed for BGA, QFN, CSP and other surface-mounted chip rework and re-bonding. It is widely used for replacing and repairing BGA chips in devices such as laptops, smartphones, Xbox360, PS3, game consoles, industrial control boards, etc.
This model is particularly favored by professional repair shops and electronics factories, providing reliable after-sales service and efficient BGA rework capabilities.
The WDS-650 is equipped with independent three-zone heating, high-definition optical alignment, and an intelligent touch screen interface, ensuring precise positioning and uniform welding. Regardless of whether lead-free or traditional welding methods are used, it can achieve consistent welding results.
Operating System
- Manual and precise operation modes can achieve complete control during the rework process.
- Capable of performing various BGA chip welding, desoldering, picking, mounting and replacement.
- User-friendly interface, featuring high-definition optical alignment and intuitive touch screen.
Strict temperature control system
- Supports six programmable temperature curves, suitable for preheating, holding, welding and cooling, with an accuracy of ±1°C. °C accuracy
- Utilizes independent closed-loop control and is equipped with a high-precision K-type thermocouple to ensure consistency in reflow soldering.
- Equipped with an external temperature sensor to monitor and calibrate the real-time soldering curve to achieve the best accuracy.
Safety System
- Meets international standards and is certified with CE, ensuring safety.
- Equipped with automatic power-off protection to handle abnormal operation or system failures.
- Features dual over-temperature protection to ensure stable performance and protect sensitive components.
How to separate the BGA chip from the motherboard?
How to replace a new BGA chip?
Maintenance steps:
- Soldering – Use a hot air gun to safely separate the BGA chip from the motherboard under precise temperature control.
- Solder pad cleaning – Remove residual solder and thoroughly clean the PCB solder pad area.
- Planting or replacement – Plant the original BGA chip or directly replace it with a new one.
- Alignment and positioning – Achieve precise alignment through screen printing marks, manual experience, or the built-in high-definition optical camera system.
- Welding – Use the three-zone heating system of WDS-650 and programmable reflow soldering curves to precisely install and weld the new chip.
Parameter of WDS-650 Automatic BGA Rework Station
| Power |
AC 220V ±10% 50/60Hz, 5.4 kVA |
| Total Power |
Max 6400W |
| Heater Power |
Upper Temp Zone 1200W, Second Temp Zone 1200W, IR Temp Zone 4000W |
| Temperature Controlling |
K-sensor Closed Loop Control, Independent Temperature Control |
| PCB Size |
Max: 470 × 380 mm, Min: 10 × 10 mm |
| BGA Application |
Max: 70 × 70 mm, Min: 1 × 1 mm |
| Alignment System |
Optical Lens + HD Industrial Camera |
| Tip Spot Monitoring |
Optical External Camera for Solder Ball Melting Process Monitoring |
why choose us?
- We are the Manufacturer= own factory+ machine design+Sheet metal produced by ourself+spray the powder+ strong assemble the machine team + packaging+free training.
- More than 11 years experiences in PCB BGA chips rework station, Over 20 R&D engineers.
- Has been the biggest factory in the BGA rework field in China.
- HUAWEI,TCL,ZTE,MEIZU,KONKA,LENOVO,FOXCONN vendor.
5.Over 100000 Global User.
- Speedy and high quality customer service and whole-life after-sale service.
- Deliver goods to customer all over the world with speed and precision.
