Professional HD External Camera Module

Advanced Camera Module

Professional HD external camera module with optical lens for BGA rework station motherboard soldering repair vision

The Professional HD External Camera Module is designed for precise BGA rework station applications and motherboard repair tasks. It features a high-quality optical lens that ensures clear and detailed imaging during soldering and inspection. The advanced camera system enhances visibility, allowing accurate alignment of components. Its stable performance supports efficient microscope-based rework operations. Ideal for professional environments, it delivers reliable and high-definition visual support.

Key Attributes Description Video

Previous Next

Key Attributes

Machine Type	Welding Manipulator	Type	Welding Head
Voltage	110V / 220V	Current	Dependable
Welding Mode	Hot Air Heating & IR Heating	Condition	New
Warranty	1 Year	Material	Metal
Rated Capacity	800 W	Max Input Power	800 W
Brand Name	Wisdomshow (WDS)	Dimensions	L30 × W20 × H10 mm
Place of Origin	Guangdong, China	Weight (kg)	2 kg
Usage	BGA Rework Station	Machine Type	PCB BGA Repair Tool Machine
PCB Size	Max 380 × 280 mm, Min 10 × 10 mm	BGA Chip Size	Max 60 × 60 mm, Min 1 × 1 mm
Power Supply	AC 110V / 220V ±10% 50Hz	Electrical Material	High Sensitive Temperature Control Module, Touch Screen (Taiwan)
Positioning Way	V-shape Card Slot, Adjustable PCB Holder	Rated Duty Cycle	Dependable
After-sales Service	Engineers Available to Service Machinery Overseas	After Warranty Service	Video Technical Support
Certification	CE, ISO

Packaging and Delivery

Selling Units	Single Item	Package Size per Batch	30 × 20 × 10 cm
Gross Weight per Batch	2.000 kg

IMPORTANT INSTALLATION NOTICE:

This external camera requires drilling a hole in your BGA rework station to mount the bracket securely.Installation involves modification of your equipment. If you are not a professional or do not have the necessary tools, please do not purchase. We are not responsible for damage caused by improper installation.

Technical Specifications

Resolution	800 Lines	Supported Resolution	800 × 600 (1024 × 768 Supported)
Output Mode	AV / BNC	Color	Colorful
Scanning Method	Line by Line Scanning	Frame Rate	60 Frames / Second
White Balance	Automatic	Pixel Size	2.8 μm × 2.8 μm
Data Bits	10 Bit	Shutter Type	Digital Shutter
Working Temperature	0 – 60 °C	Power Supply	External 12V DC (±10%)
Dynamic Range	> 60 dB	Exposure Time	54 ms – 540 ms (Auto Exposure)
Interface	Standard C Interface	Lens	Manual Focus Aperture Lens (Optional)

Equipment Overview

The WDS-620 is a semi-automatic, high-precision BGA rework station designed for professional rework of complex SMT components. It features an independent three-zone temperature control system, high-definition optical alignment, and an intelligent operating interface.This extended version includes an additional external side camera, allowing operators to clearly observe the solder melting process during reflow, ensuring higher accuracy and improved quality control.

Key Features of WDS-620 Rework Station

Independent Three-Zone Temperature Control System

Upper and lower heating zones use hot-air circulation; the IR preheating zone uses infrared heating.
Temperature accuracy ±1°C, supporting 8-segment temperature profiles.
Large IR bottom heater ensures uniform PCB heating and prevents board warpage.
Each heating unit can be controlled independently.
Supports localized hot-air heating on BGA and PCB simultaneously while preheating the entire bottom area.
K-type thermocouple closed-loop, PID auto-tuning, multi-curve display, curve analysis, external thermal sensor input for real-time curve calibration.
All temperature parameters adjustable directly on the touchscreen.

Precise Optical Alignment System

High-definition CCD color vision with beam splitting, zoom, autofocus.
Automatic color difference compensation and brightness adjustment.
15-inch HD display for clear alignment view.
Alignment accuracy: ±0.01 mm.