Key features
1.High-Definition Optical Vision Alignment System
Achieve perfect placement every time with our advanced digital optical positioning. The system features a V-groove PCB holder and multi-axis fine-tuning (X, Y, R-axis), allowing for rapid and ultra-precise alignment of BGA chips and other components. This eliminates human error and is particularly crucial when operating as a reliable mobile IC reballing machine for compact smartphone and tablet boards, ensuring chips are positioned perfectly before reflow.
2.Fully Automated Process with Intelligent Control
This is a true full automatic BGA rework station. The entire cycle-preheating, heating, vacuum pickup, placement, and cooling-is controlled by the intelligent system. A configurable voice alarm alerts you before process completion. This hands-off automation is ideal for consistent, high-volume work, such as batch CPU reballing machine operations for laptop and desktop motherboard repairs, guaranteeing uniform results across every unit.
3.Professional Three-Zone Independent Heating & Cooling
Experience superior temperature management with independent top, bottom 1, and bottom 2 heating zones, each utilizing advanced PID control algorithms. This setup ensures uniform heating across the entire PCB area, preventing warping and cold joints. Coupled with a high-power cross-flow cooling fan, it rapidly stabilizes the board post-solder. This precise thermal management (±2°C accuracy) is what makes the DH-G600 an exceptional choice for demanding CPU reballing and sensitive mobile IC reballing.
4. User-Friendly HD Touch Interface with Data Port
Operate with ease through a large, intuitive HD touchscreen. It provides real-time display and analysis of preset vs. actual temperature curves, allowing for immediate correction. Store thousands of custom profiles for different chips and call them up instantly. The built-in USB port enables easy data export for quality control and firmware updates, adding a layer of professionalism and traceability to your workshop.
