High-Precision Chip Handling

BGA Chip Soldering Desoldering Station

Our infrared BGA reballing station features a dual-CCD optical alignment system for ±0.01mm precision, handling chips from 10x10mm to 90x90mm. Its intelligent 3-zone heating and computer control enable one-click, fully automated soldering and desoldering station operations. Designed as precision mobile phone IC repair equipment, it ensures repeatable, professional results.

Features:

• Dual CCD Alignment
• Intelligent Zone Heating
• Fully Automated Operation